发明名称 |
Imaging element, image pickup apparatus, manufacturing apparatus and manufacturing method |
摘要 |
There is provided an imaging element including a transmission channel region provided in an optical black pixel region shielded from light from an outside of a semiconductor substrate by a light shielding film, for transmitting a charge existing inside the semiconductor substrate of the optical black pixel region to an outside of the optical black pixel region. |
申请公布号 |
US9029969(B2) |
申请公布日期 |
2015.05.12 |
申请号 |
US201213584244 |
申请日期 |
2012.08.13 |
申请人 |
Sony Corporation |
发明人 |
Endo Suzunori |
分类号 |
H01L27/146;H01L27/148;H01L21/00;H04N5/361 |
主分类号 |
H01L27/146 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. An imaging element comprising:
a transmission channel region provided in an optical black pixel region shielded from light from an outside of a semiconductor substrate by a light shielding film, for transmitting a charge existing inside the semiconductor substrate of the optical black pixel region to an outside of the optical black pixel region, wherein the photoelectric conversion element provided in the optical black pixel region is formed near a boundary face of the semiconductor substrate to be thinner than a photoelectric conversion element provided in an effective pixel region. |
地址 |
Tokyo JP |