发明名称 LIFE PREDICTION STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method capable of accurately predicting a life of a solder by mounting a mechanism on a board for predicting that a solder connected portion of a mounted component connected to a circuit board comes to the end of a creep rupture life by an electrical scheme for breaking of a wire before the component connected portion.SOLUTION: Provided is a life prediction structure including a non-horizontal circuit board in a housing, metal singulated pieces 2 being soldered to two lands 11 connected to a breaking-of-wire detection circuit 12 formed on the circuit board with a small gap between the pieces 2.</p>
申请公布号 JP2015090332(A) 申请公布日期 2015.05.11
申请号 JP20130230788 申请日期 2013.11.07
申请人 HITACHI LTD 发明人 NAKATSUKA TETSUYA;DIGNA LINAJAYA;HATA SHOHEI
分类号 G01N17/04;G01N19/00;H05K3/34 主分类号 G01N17/04
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