发明名称 |
LIFE PREDICTION STRUCTURE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method capable of accurately predicting a life of a solder by mounting a mechanism on a board for predicting that a solder connected portion of a mounted component connected to a circuit board comes to the end of a creep rupture life by an electrical scheme for breaking of a wire before the component connected portion.SOLUTION: Provided is a life prediction structure including a non-horizontal circuit board in a housing, metal singulated pieces 2 being soldered to two lands 11 connected to a breaking-of-wire detection circuit 12 formed on the circuit board with a small gap between the pieces 2.</p> |
申请公布号 |
JP2015090332(A) |
申请公布日期 |
2015.05.11 |
申请号 |
JP20130230788 |
申请日期 |
2013.11.07 |
申请人 |
HITACHI LTD |
发明人 |
NAKATSUKA TETSUYA;DIGNA LINAJAYA;HATA SHOHEI |
分类号 |
G01N17/04;G01N19/00;H05K3/34 |
主分类号 |
G01N17/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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