发明名称 METHOD OF PRODUCING ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of producing an electronic apparatus which can suppress deformation of the terminal in insert-molding a terminal folded two or more times in a mold resin.SOLUTION: In a method of producing an electronic apparatus, a mold 70 provided with a gate 72, a first contact part 73, a second contact part 74 and a pin 75 is prepared, and the pin 75 is arranged immediately under the gate 72 in a space part 71 of the mold 70. The first contact part 73 is brought into contact with a first part 31 of a terminal 30, and the second contact part 74 of the mold 70 is brought into contact with a second part 32 of the terminal 30. Then, a molten mold resin 20 is poured into the space part 71 through the gate 72 of the mold 70. The first part 31 of the terminal 30 is pressed down toward the first contact part 73 by a part of the molten mold resin 20 caused to impinge on the pin 75, and the second part 32 is pressed down toward the second contact part 74.</p>
申请公布号 JP2015089642(A) 申请公布日期 2015.05.11
申请号 JP20130230172 申请日期 2013.11.06
申请人 DENSO CORP;DAIICHI SEIKO CO LTD 发明人 MIKI TAKUYA;NAGATOMO TAKAAKI;KIRA YOSHIHIRO
分类号 B29C45/14;B29C45/26 主分类号 B29C45/14
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