| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which can make it unlikely to transfer an external force applied to a terminal to the inside of a resin.SOLUTION: A semiconductor package 100 comprises power elements 110, lead frames 120, a mold resin 140 and terminals 150. The lead frames 120 are electrically and thermally connected with the power elements 110. The mold resin 140 encapsulates the power elements 110 and the lead frames 120. Each of the terminals 150 is formed by a part of the lead frame 120 and partially protrudes from the mold resin 140 and has a narrow part 150A and a wide part 150B. The wide part 150B is arranged at least at a boundary part b with the mold resin 140 and the narrow part 150A is arranged between a bonding part s with an external terminal 200 and the boundary part b. |
