COMPOSITE METAL FILM, AND METHOD OF CIRCUIT PATTERN FORMATION OF PRINTED CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a composite metal film, and more specifically, a composite metal film for use in circuit pattern formation of a printed circuit board.SOLUTION: To realize a fine-pitch circuit pattern in a printed circuit board, a composite metal film 100 comprises: a support 110; and a metal layer 120 that is joined to one face of the support 110 and has a nodule layer 130 formed on an external face. The metal layer 120 is made of metal of a different material than the nodule layer 130.