| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can acquire a warp amount of a warp amount acquisition target region without providing a special device for acquiring the warp amount of a substrate.SOLUTION: A surface mounting device 100 (substrate processing apparatus) comprises: a camera unit 52 which images a surface of a substrate 200 for substrate processing and images the substrate 200 as a warp amount acquisition target region; and a main control part 91 for acquiring a distance D1 as a distance between at least predetermined two substrate recognition marks 201a and 201b on the basis of an image of the substrate 200 imaged by the camera unit 52 to acquire a warp amount &Dgr;H of the substrate 200 on the basis of the distance D1 and a distance D as a reference value between the substrate recognition marks 201a and 201b of the substrate 200 without warp. |
