发明名称 |
APPARATUS FOR TREATING SUBSTRATE |
摘要 |
The present invention relates to an apparatus for treating a substrate, and more specifically, to an apparatus for treating a substrate using plasma. According to an embodiment of the present invention, the apparatus for treating the substrate comprises: a chamber having a processing space in which an upper surface is opened inside; a support unit arranged in the chamber and supporting the substrate; a dielectric assembly installed on the opened upper surface of the chamber and covering the opened upper surface; and a plasma source installed on an upper side of the dielectric assembly and having an antenna which generates gas supplied in the chamber, wherein the dielectric assembly comprises: a dielectric window; and a heating unit of a non-metal material installed on an upper part of the dielectric window and heating the dielectric window. |
申请公布号 |
KR20150051192(A) |
申请公布日期 |
2015.05.11 |
申请号 |
KR20150033392 |
申请日期 |
2015.03.10 |
申请人 |
SEMES CO., LTD. |
发明人 |
KIM, HYUNG JOON;KIM, SEUNG KUE |
分类号 |
H01L21/3065;H01L21/02;H01L21/205;H01L21/324;H01L21/683;H05H1/46 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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