| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a connection structure capable of enhancing both adhesion to a substrate and adhesion to a conductor while maintaining excellent electrical connection between layers or between electrodes, and achieving highly reliable connection, and to provide a copper particle-containing paste for forming the connection structure.SOLUTION: The connection structure includes two copper conductors 2, 2 forming a part of a circuit on a substrate 1, and a sintered copper compact 3 connecting the two copper conductors 2, 2. Oxygen concentration in the sintered copper compact 3 is less than 10% in terms of average number of atoms concentration measured by EDX method. The sintered copper compact 3 has a substrate abutting part 31 abutting against the substrate 1, and conductor abutting parts 32, 32 abutting against the two copper conductors 2, 2, and the oxygen concentration of the substrate abutting part 31 is higher than that of the conductor abutting part 32.</p> |
