发明名称 WAFER TRANSFER APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To solve a problem in that when each wafer is transferred between FOUP and the sample chamber of a wafer processor, the wafer passes via a mini-environment device surrounded by air atmosphere, the wafer is consequently exposed to air, which may result in wafer contamination with air during the transfer and, hence, for a wafer the surface of which is sensitive in particular, a transfer system that minimizes exposure of the surface to air is indispensable.SOLUTION: A wafer transfer apparatus transfers a wafer between FOUP, which is a container storing a plurality of wafers, and the inside of a wafer processor, which subjects each wafer to processing. A moving mechanism, which moves while holding a wafer, is covered with a local case, and specific gas is introduced into the local case. While a wafer is stored in the local case, the wafer is transferred. Thus, a wafer can be transferred almost without in contact with air, and a danger of surface contamination of the wafer can be reduced.</p>
申请公布号 JP2015090940(A) 申请公布日期 2015.05.11
申请号 JP20130230775 申请日期 2013.11.07
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 SUMINOYA MOTOHIRO
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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