THERMOELECTRIC MODULE ASSEMBLY FOR DEHUMIDIFIER

摘要

The present invention relates to a thermoelectric module assembly for a dehumidifier. The thermoelectric module assembly according to one embodiment of the present invention includes a thermoelectric module and first and second heat sinks which are attached on the upper and lower sides of the thermoelectric module, respectively. The thermoelectric module includes a substrate, a plurality of thermoelectric semiconductors which are formed on the substrate, a plurality of first conductive layers which electrically connect the adjacent thermoelectric semiconductors on the upper sides of the thermoelectric semiconductors, a plurality of second conductive layers which are interposed between the thermoelectric semiconductors and electrically connect the adjacent thermoelectric semiconductors, and an insulation adhesive layer which is interposed between the first conductive layer and the first heat sink and combines the first conductive layer with the first heat sink.