| 摘要 |
The present invention discloses a method for processing a layer via hole. The method for processing a layer via hole includes: a surface treating process of coating cobalt on a copper foil between upper or lower copper foil on the upper side of CCL of which a laser beam is to be radiated; a via forming process by removing the copper foil with surface treatment and prepreg using a laser drilling; and a process of packing the via with copper plating. |
