RESIN COMPOSITION

摘要

Embodiments of the present invention relates to a resin composition for an encapsulment including a polyolefin resin having two crystalization temperatures. An encapsulment having high light transmissivity and low haze value even under a low lamination condition is provided by the resin composition, and the resin composition including the polyolefin resin is used in manufacturing of various kinds of photoelectron devices, thereby providing an encapsulment having excellent adhesion with a front substrate and a back sheet included in the device, and especially having improved long term adhesion and heat resistance.