MANUFACTURING METHOD OF HIGH STRENGTH COPPER FOIL USING MICRO-HARDENING AND HIGH STRENGTH COPPER FOIL MANUFACTURED BY THE SAME

摘要

The present invention relates to a manufacturing method for copper foil capable of being suitably used to improve performance of copper foil for an electrode for a secondary battery and a PCB as the present invention forms a very thin copper foil having a thickness of 4 μm through electrolytic plating and has high strength, capable of coiling the very thin copper foil. According to the present invention, the manufacturing method for copper foil forms electrolytic copper foil containing tin with electrolysis of copper plating solution which contains copper (Cu) ion 0.5 to 1 mol / L, tin (Sn) ion 0.025 to 0.1 mol / L, sulfuric acid (H_2SO_4) 30 to 90 g / L, and chlorine (Cl) ion to extract copper and tin on a substrate.