The present invention relates to a power module package. The power module package according to an embodiment of the present invention comprises; a metal substrate wherein a hole is formed; an internal heat radiation unit which is formed by filling the hole with metal in which the thermal conductivity is higher than a material of the metal substrate; a lead frame which is formed on one side of the metal substrate; a semiconductor die which is mounted on one side of the metal substrate and is electrically connected to the lead frame; and a heat spread which is formed on the metal substrate. One end of the heat spread is connected to the internal heat radiation unit, and the other end is connected to one side of the metal substrate wherein the semiconductor die is mounted. The heat spread rapidly transmits a heat generated in the semiconductor die to the outside and radiates the heat. Therefore, heat emission can be maximized.
