| 摘要 |
Disclosed is a substrate wherein heat dissipation is improved even without attaching a heat dissipating member to the substrate using an intermediate member, such as grease. A substrate main body (3) having an electronic component (2) mounted thereon, and a heat dissipation promoting section (4), which promotes dissipation of heat from the substrate main body (3) are integrally formed. The heat dissipation promoting section (4) is formed on the outer surface of the substrate main body (3). The front surface (3a) of the substrate main body (3) is a portion having the electronic component (2) mounted thereon, and the rear surface (3b) of the substrate main body (3) is a portion having the heat dissipation promoting section (4) formed thereon. A cooling channel (9) is formed inside of the heat dissipation promoting section (4), said cooling channel passing through a cooling medium for cooling. |
