| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a power semiconductor module that allows enhancing the heat resistance of silicone gel filled in a case, thereby being used under high-temperature environment.SOLUTION: A power semiconductor module 1 includes: a power semiconductor element 2; an insulating substrate 3 above which the power semiconductor element 2 is mounted; a resin case 6 housing the power semiconductor element 2 and the insulating substrate 3; silicone gel 11 injected into the resin case 6; and a sheet 12 provided between the resin case 6 and the silicone gel 11 in the resin case 6, and composed of silicone rubber or a silicone resin.</p> |
