发明名称 SEMICONDUCTOR LASER DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor laser device in which a Peltier element can be prevented from being broken.SOLUTION: A semiconductor laser device 1 according to the present invention includes: a plurality of semiconductor lasers 2 emitting laser beams; a laser support 3 supporting the plurality of semiconductor lasers 2 at one side 31 thereof and having thermal conductivity and thermal expandability; a plurality of Peltier elements 5 each of which has a heat absorbing part 53 coupled to the other side 32 of the laser support 3 in order to cool the laser support 3; and a Peltier cooling part 6 coupled to a heat dissipating part 54 of each of the Peltier elements 5 in order to cool each of the Peltier elements 5. The laser support 3 transfers heat from the semiconductor lasers 2 to the Peltier elements 5 so that the temperature difference between the heat absorbing part 53 and the heat dissipating part 54 becomes smaller as the Peltier element 5 is disposed to be further apart from the origin point of thermal expansion.</p>
申请公布号 JP2015088682(A) 申请公布日期 2015.05.07
申请号 JP20130227987 申请日期 2013.11.01
申请人 USHIO INC 发明人 KONYA WATARU
分类号 H01S5/024 主分类号 H01S5/024
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