发明名称 HIGH-HEAT-RESISTANCE POLYPROPYLENE RESIN COMPOSITION AND RESIN MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To provide a polypropylene resin composition usable even in resin products to be applied with a load at high temperatures and a resin molding composed of the polypropylene resin composition.SOLUTION: A polypropylene resin composition comprises (A) polypropylene, (B) a maleimide-modified polystyrene, (C) a polyphenylene ether and (D) a compatibilizer. Preferably, with respect to 105 pts. mass of the polypropylene resin composition, the content of (A) polypropylene is 40-80 pts. mass; the content of (B) the maleimide-modified polystyrene is 10-50 pts. mass; the content of (C) the polyphenylene ether is 0.5-30 pts. mass; and the content of (D) the compatibilizer is 1-15 pts. mass.</p>
申请公布号 JP2015086285(A) 申请公布日期 2015.05.07
申请号 JP20130225293 申请日期 2013.10.30
申请人 HITACHI CHEMICAL CO LTD 发明人 KOFUNE MIKA;NAGAI AKIRA;NAKAMURA SHIGEYA
分类号 C08L23/12;C08L25/06;C08L53/02;C08L71/12 主分类号 C08L23/12
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