| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin excellent in handling property at normal temperature, easily molded or prepared into a compound through a melt-kneading process, and excellent in flame retardancy, heat resistance and moisture resistance as a cured product, and to provide an epoxy resin composition, a sealing material for a semiconductor, a cured product of the epoxy resin composition, and a semiconductor device using the composition. <P>SOLUTION: The epoxy resin composition contains, as essential components, an epoxy resin (A) and a curing agent (B). The epoxy resin (A) is a crystallized product of a naphthalene type epoxy resin obtained by reacting 1,4-dihydroxynaphthalene with epihalohydrin, exhibiting a melt peak from 80°C to 105°C measured by differential scanning calorimeter (DSC) at a 3°C/min temperature elevation rate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
