| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent deterioration of bonding strength of wire bonding in a soldering apparatus which performs reflow soldering while pressurizing a semiconductor element toward a substrate. <P>SOLUTION: In the soldering apparatus which performs reflow soldering while pressurizing a semiconductor element 2 toward a substrate 1 by a weight 12, a pressure contact surface 121a of the weight 12, which comes into contact with the semiconductor element 2, is mirror-finished. Accordingly, a wire bonding execution surface 2a of the semiconductor element 2 can be prevented from being damaged in a reflow soldering process, and deterioration of bonding strength of wire bonding can thus be prevented. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
