发明名称 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, ENCAPSULATING AGENT, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 Provided is a curable resin composition capable of forming a cured product that excels in heat resistance, transparency, and flexibility and particularly excels in barrier properties against a corrosive gas (e.g., sulfur oxide).;The curable resin composition includes a compound (U) containing an aliphatic carbon-carbon unsaturated bond and a compound (H) containing a hydrosilyl group and includes at least one of a ladder-type silsesquioxane [A1] and a ladder-type silsesquioxane [A2], where the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard, and the ladder-type silsesquioxane [A2] contains a hydrosilyl group and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard.
申请公布号 US2015126700(A1) 申请公布日期 2015.05.07
申请号 US201314395016 申请日期 2013.05.17
申请人 DAICEL CORPORATION 发明人 Kamuro Shigeaki;Kuwana Akihiro;Harada Nobuhiko
分类号 C08G77/18;H01L33/56 主分类号 C08G77/18
代理机构 代理人
主权项
地址 Osaka-shi, Osaka JP