| 摘要 |
PROBLEM TO BE SOLVED: To provide: a thermal interface sheet capable of removing generated voids from a joining surface, and capable of achieving joining less in voids and excellent in heat dissipation; and the like.SOLUTION: A thermal interface sheet 10 is configured of four kinds of solders having different melting points from each other, and includes a first solder region 11, a second solder region 12, a third solder region 13, and a fourth solder region 14. The melting point of each solder region satisfies a relation: a melting point in the first solder region 11<a melting point in the second solder region 12<a melting point in the third solder region 13<a melting point in the fourth solder region 14. |
