| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device, coping with resin-sealing of a smaller and multipiece lead frame, being possible with precise positioning, and having less stress on the lead frame, in a manufacturing step for a semiconductor device.SOLUTION: A lower molding die 2 of a pair of upper and lower molding dies that resin-seal a lead frame on which a semiconductor chip is mounted, is provided with a positioning pin 3, which is tapered and becomes thinner as approaches a tip, engaging with a positioning hole of the lead frame, and a protruding pin 4 and a pair of protruding pins 5 for making a package be protruded from the die after molding. The protruding pin 4 and the pair of protruding pins 5 are fixed to a protruding pin interlock mechanism 6, and vertically move in accordance with the vertical movement of the protruding pin interlock mechanism 6. Thus, for improved positional precision, the positioning pin 3 which is tightly fitted in a frame positioning hole can be easily removed with no deformation of the frame positioning hole, with deformation of the positioning hole being prevented. |
