| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic module which stably secures the ability of conducting heat from an electronic component to a radiator.SOLUTION: An electronic module 1 includes a radiator 10 and a power semiconductor device 20 (an electronic component) which is fastened to the radiator 10 through thermal grease 2 by a screw member 6 (screw fastening means). Spacers 3A which hold the power semiconductor device 20 separated from the radiator 10 is provided between the radiator 10 and the power semiconductor device 20. |
