| 摘要 |
The present invention relates to a power module package and a manufacturing method thereof. According to an embodiment of the present invention, the power module package comprises: a substrate having one surface and the other surface; a lead frame separated at regular distance with one surface of the substrate, having one side and the other side, and where one side protrudes to the inside, and the other side protrudes to the outside; a semiconductor device mounted on the lead frame; and a molding unit interposed between one surface of the substrate and the lead frame, and formed to expose the other surface of the substrate by covering one surface of the substrate, the lead frame, and the semiconductor device. |
