COOLING MECHANISM FOR SPUTTERING CATHODE, AND METHOD OF MANUFACTURING BASE MATERIAL FOR WIRING BOARD USING SPUTTERING DEVICE HAVING THE COOLING MECHANISM

摘要

PROBLEM TO BE SOLVED: To provide a cooling mechanism for sputtering cathode that can suppress a decrease in cooling efficiency due to warpage of a target without using any complex mechanism for a sputtering device which fits the target to a base plate and cools the target indirectly.SOLUTION: A housing 1 of a sputtering cathode is fitted with a base plate 2. The base plate 2 is fitted with a target 4. A cooling medium 7 is made to flow in the housing 1, and a thickness of the base plate 2 and a pressure of the cooling medium 7 are set to suitable values. Consequently, the base plate 2 follows up deformation of the target 4 and there is no gap formed between a cooling surface 4b of the target 4 and the base plate 2, so that cooling is never insufficient.