METHOD FOR SETTING SURFACE REGION FOR ARRANGING HEAT SINK ON REAR FACE OF WIRING PORTION OF A CHIP SUPPORTING SUBSTRATE, AND CHIP SUPPORTING SUBSTRATE AND CHIP MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide chip mounting techniques excellent in electrical characteristics of a voltage drop and also excellent in thermal characteristics of heat radiation.SOLUTION: A method comprises: determining a set of a cross-sectional area and a length of an electrically conductive layer of a wiring portion 225 provided on a chip-supporting substrate 220 so as to satisfy a permissible value of a voltage drop associated with the electrically conductive layer (310); determining a set of lengths of the electrically conductive layer and an insulating layer such that the electrically conductive layer and the insulating layer when set to have the cross-sectional area of the set of the cross-sectional area and the length of the electrically conductive layer determined for the permissible value of the voltage drop satisfy a desired value of thermal resistance associated with the electrically conductive layer and the insulating layer of the wiring portion (320); and selecting a length of an electrically conductive layer corresponding to the cross-sectional area of an electrically conductive layer to be used from the set of the cross-sectional area and the length of the electrically conductive layer determined for the permissible value of the voltage drop, and setting a surface region 230 for arranging a heat sink thereon to an area in the range between a maximum value and a minimal value, where the maximum value is an area determined by a selected length of the electrically conductive layer, and the minimal value is an area determined by selected lengths of the electrically conductive layer and the insulating layer, the lengths selected to correspond to the cross-sectional area of the electrically conductive layer to be used from the set of the lengths of the electrically conductive layer and the insulating layer determined for the desired value of the thermal resistance (330).