发明名称 ヒートポンプ暖房システム
摘要 <p>In the present invention, a heating bypass valve (119) is provided to a low temperature heating bypass path (118), and at the downstream side of the low temperature heating bypass path (118), a buffer tank (49) is provided to a heating circulation path (40) on the upstream side of a heat pump heat exchanger (55). If heating implementation conditions have not been established, and a prescribed period (M) has not elapsed since the cessation of operation of the heat pump (51), a controller (150) causes the low temperature heating bypass valve (119) to open, and causes the heat pump (51) to continue operating.</p>
申请公布号 JP5712196(B2) 申请公布日期 2015.05.07
申请号 JP20120265831 申请日期 2012.12.04
申请人 シャープ株式会社;リンナイ株式会社 发明人 太田 孝二;柿内 敦史;小川 純一
分类号 F24D3/00 主分类号 F24D3/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利