| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which inhibits addition of connection resistance and occurrence of connection failure.SOLUTION: A multilayer wiring board includes: an electronic component; electrodes provided at the electronic component; an adhesion layer with which the electronic component is overlapped; and vias which are formed at the adhesion layer, each of the vias having an end part connected with the electrode. At least a part of a side surface of each electrode of the electronic component contacts with the via. Thus, even if misalignment between the via and the electrode occurs, reduction of a contact area between the via and the electrode is inhibited.</p> |
