发明名称 電子機器用筐体及び電子機器
摘要 <p>In a cabinet for electronic apparatus, when Mg-Li alloy is employed to reduce weight of the cabinet and depressions are molded on a surface of the cabinet through presswork by using the Mg-Li alloy, neither a rough surface nor a crack appears in any bent portion forming the depressions of the cabinet. In a cabinet for electronic apparatus including a bump shape including at least one surface formed by conducting presswork for magnesium-lithium alloy, the bump shape is a shape in which a new surface formed when a reference surface before the presswork of the magnesium-lithium alloy is pushed toward the inside of the cabinet by the presswork and is placed apart from the reference surface is surrounded by the reference surface, the surface has a plate thickness t (mm) in a range of 0.4@t@2.0, and at least one bent portion constituting the bump shape has a radius of curvature R (mm) in a range of t@R.</p>
申请公布号 JP5715095(B2) 申请公布日期 2015.05.07
申请号 JP20120150948 申请日期 2012.07.04
申请人 发明人
分类号 H05K5/02;B21D22/20;B21D22/26 主分类号 H05K5/02
代理机构 代理人
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