MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD

摘要

A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

主权项

1. A method for manufacturing a multi-layer circuit board, comprising:
providing a substrate, the substrate comprising two surfaces opposite to each other and a first via connecting the surfaces; forming a first patterned circuit layer on each of the surfaces by using the first via as an alignment target, wherein each of the first patterned circuit layers comprises a first concentric-circle pattern surrounding the first via; forming a first stacking layer on each of the surfaces, the first stacking layer comprising a first dielectric layer and a first circuit layer covering the first dielectric layer; forming a first through hole, the first through hole penetrating regions of the first stacking layers and the substrate where an inner diameter of a first concentric circle from a center of the first concentric-circle pattern is orthogonally projected on; forming a second stacking layer on each of the first stacking layers, each of the second stacking layers comprising a second dielectric layer and a second circuit layer covering the second dielectric layer; and forming a second through hole penetrating regions of the second stacking layers, the first stacking layers, and the substrate where an inner diameter of a second concentric circle from the center of the first concentric-circle pattern is orthogonally projected.