发明名称 |
SEPARATING A WAFER OF LIGHT EMITTING DEVICES |
摘要 |
Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The light emitting devices are disposed in rows. The method includes dividing the wafer into a plurality of regions. Each region comprises a plurality of rows of light emitting devices and a first region is wider than a second region. For each region, the method includes determining a position of first and second dicing streets. The dicing streets are located between the rows of light emitting devices. The method includes determining, using the position of the first and second dicing streets, positions of a plurality of dicing streets disposed between the first and second dicing streets. The method includes cutting the wafer along streets. |
申请公布号 |
WO2015063655(A1) |
申请公布日期 |
2015.05.07 |
申请号 |
WO2014IB65545 |
申请日期 |
2014.10.22 |
申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
PEDDADA, SATYANARAYANA RAO;WEI, FRANK LILI |
分类号 |
H01L33/00;B23K26/00;B23K26/40;G01N21/88;H01L21/78 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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