发明名称 LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT AND ILLUMINATION DEVICE
摘要 The present invention relates to a lead frame for a light emitting device and a light emitting device package which can prevent a package crack phenomenon and largely enhance illuminating power. The present invention comprises: a body unit on which the light emitting device can be settled and encapsulating material can be installed; an exposure terminal unit which is connected to the body unit and exposed to the outside from the encapsulating material so as to make an electric contact with an external terminal; and a first bending part which is connected to the body unit and can make a contact with the encapsulating material so as to expand an electric and thermal contact area.
申请公布号 KR20150048579(A) 申请公布日期 2015.05.07
申请号 KR20130128822 申请日期 2013.10.28
申请人 LUMENS CO., LTD. 发明人 OH, SEUNG HYUN;HAN, KANG MIN;LEE, SEUNG HOON;KIM, PYOUNG GUG;CHO, YUN GEON
分类号 H01L33/62 主分类号 H01L33/62
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