发明名称 |
LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT AND ILLUMINATION DEVICE |
摘要 |
The present invention relates to a lead frame for a light emitting device and a light emitting device package which can prevent a package crack phenomenon and largely enhance illuminating power. The present invention comprises: a body unit on which the light emitting device can be settled and encapsulating material can be installed; an exposure terminal unit which is connected to the body unit and exposed to the outside from the encapsulating material so as to make an electric contact with an external terminal; and a first bending part which is connected to the body unit and can make a contact with the encapsulating material so as to expand an electric and thermal contact area. |
申请公布号 |
KR20150048579(A) |
申请公布日期 |
2015.05.07 |
申请号 |
KR20130128822 |
申请日期 |
2013.10.28 |
申请人 |
LUMENS CO., LTD. |
发明人 |
OH, SEUNG HYUN;HAN, KANG MIN;LEE, SEUNG HOON;KIM, PYOUNG GUG;CHO, YUN GEON |
分类号 |
H01L33/62 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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