发明名称 半導体装置
摘要 A semiconductor device has a field effect transistor (FET), a mounting member, an output matching circuit board, a relay board, and first and second bonding wire. The FET includes plural cell regions arranged dispersedly and plural drain terminal electrodes connected to each cell region. The output matching circuit board is provided between an output conductive part and the FET, and has a first insulating substrate and a conductive part. A relay board is provided between the output matching circuit board and the FET. The relay board includes a second insulating substrate having a permittivity lower than a permittivity of the second insulating substrate of the output matching circuit board, and which has a relay conductive part on an upper surface of the second insulating substrate.
申请公布号 JP5711778(B2) 申请公布日期 2015.05.07
申请号 JP20130044616 申请日期 2013.03.06
申请人 株式会社東芝 发明人 高木 一考
分类号 H03F3/20;H01L21/338;H01L27/095;H01L29/778;H01L29/812 主分类号 H03F3/20
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