| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance reliability of soldering and to reduce a mounting space, in mounting an electronic component on a circuit board by soldering. <P>SOLUTION: In the method for manufacturing an electronic device 1 which includes a circuit board 3 with a land 11 and an electronic component 2 with a plate-like lead terminal 10 electrically connected to the land and in which the lead terminal is laser-soldered to the land, the lead terminal is erected on the land, and an exposed irradiation surface provided at part of the lead terminal is irradiated with a laser beam to melt a cream solder 13 provided on the land. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
