Packaging Devices and Methods of Manufacture Thereof

摘要

Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad, a second portion of the contact pad being exposed. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to the second portion of the contact pad. A PPI pad is disposed over the passivation layer and is coupled to the PPI line. An insulating material is disposed over the PPI line, the PPI pad being exposed. The insulating material is spaced apart from an edge portion of the PPI pad by a predetermined distance.

主权项

1. A packaging device, comprising:
a contact pad disposed over a substrate; a passivation layer disposed over the substrate and a first portion of the contact pad, wherein a second portion of the contact pad is exposed; a post passivation interconnect (PPI) line disposed over the passivation layer coupled to the second portion of the contact pad; a PPI pad disposed over the passivation layer coupled to the PPI line; and an insulating material disposed over the PPI line, wherein the PPI pad has an upper surface exposed by the insulating material and a lower surface opposing the upper surface, wherein the insulating material is spaced apart from a side surface of the PPI pad by a predetermined distance, and wherein the side surface of the PPI pad extends from the upper surface of the PPI pad to the lower surface of the PPI pad.