VIA PLACEMENT IN RADIO FREQUENCY SHIELDING APPLICATIONS

摘要

Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.

主权项

1. A wireless device comprising:
an antenna configured to facilitate at least one of transmitting or receiving a radio-frequency (RF) signal; a packaged module in communication with the antenna, the packaged module including a ground contact configured to receive a ground potential; a plurality of vias in a substrate, the plurality of vias disposed along a periphery of the packaged module, and vias of the plurality of vias being spaced closer together along the periphery of the packaged module in a hot spot than in a low radiating area; an RF circuit coupled to a major surface of the substrate; and a conductive layer disposed over the RF circuit, the conductive layer electrically coupled to the plurality of vias and the ground contact such that the plurality of vias and the conductive layer form at least a portion of an RF isolation structure around the RF circuit; and an other module in communication with the packaged module.