| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME |
| 摘要 |
Provided is a semiconductor package, the semiconductor package includes a first substrate, a first semiconductor chip which is mounted on the first substrate, a second substrate which is disposed on the first semiconductor chip, at least one second semiconductor chip which is disposed on the second substrate; and a plurality of wires which are in contact with the first substrate and the second substrate to connect the first substrate and the second substrate to each other. |
| 申请公布号 |
US2015123289(A1) |
申请公布日期 |
2015.05.07 |
| 申请号 |
US201414463854 |
申请日期 |
2014.08.20 |
| 申请人 |
PARK Jin-Woo |
发明人 |
PARK Jin-Woo |
| 分类号 |
H01L23/00;H01L23/538;H01L23/12 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a first substrate; a first semiconductor chip which is mounted on the first substrate; a second substrate which is disposed on the first semiconductor chip; at least one second semiconductor chip which is disposed on the second substrate; and a plurality of wires which are in contact with the first substrate and the second substrate to connect the first substrate and the second substrate to each other. |
| 地址 |
Seoul KR |
