发明名称 |
JUNCTION BARRIER SCHOTTKY DIODE AND JUNCTION BARRIER SCHOTTKY DIODE MANUFACTURED THEREBY |
摘要 |
<p>The present invention relates to a junction barrier Schottky diode and a junction barrier Schottky diode manufactured thereby, and, more particularly, to a junction barrier Schottky diode using a Schottky contact and a junction barrier Schottky diode manufactured thereby. To this end, a method for manufacturing a junction barrier Schottky diode of the present invention comprises the steps of: forming a n- epitaxial layer on an upper surface of a n+ substrate; forming a p+ junction barrier grid and a p+ floating field guard ring by injecting a p- type dopant on an upper surface of the n- epitaxial layer; forming a cathode electrode on a lower surface of the n+ substrate; forming a passivation film which covers some of an outermost junction barrier grid of the p+ junction barrier grid and the p+ floating field guard ring; forming a trench in an interior of the p+ junction barrier grid by etching the p+ junction barrier grid through the interior thereof; and forming an anode electrode on the upper surface of the n- epitaxial layer.</p> |
申请公布号 |
WO2015064999(A1) |
申请公布日期 |
2015.05.07 |
申请号 |
WO2014KR10163 |
申请日期 |
2014.10.28 |
申请人 |
CORNING PRECISION MATERIALS CO., LTD |
发明人 |
CHUNG, JIN WOOK;SHUR, JOONG WON |
分类号 |
H01L29/872 |
主分类号 |
H01L29/872 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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