THERMOSETTING RESIN SHEET FOR SEMICONDUCTOR CHIP SEALING AND METHOD OF PRODUCING SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin sheet for semiconductor chip sealing which can reduce curvature deformation due to volume shrinkage of a thermosetting resin sheet and is excellent in reliability and shelf stability and a method of producing a semiconductor package.SOLUTION: For a thermosetting resin sheet for semiconductor chip sealing, the activation energy (Ea) meets condition (1); the thermoset product has a glass transition temperature after a thermosetting treatment at 150°C for 1 h of 125°C or higher; and thermal expansion coefficient α [ppm/K] of the thermoset product at temperatures equal to or lower than the glass transition temperature and the storage elastic modulus E' [GPa] of the thermoset product at 25°C meet condition (2). Condition (1): 30≤Ea≤120 [kJ/mol]; and condition (2): 10,000≤α×E'≤300,000 [Pa/K].