| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a small-size semiconductor device, capable of facilitating microfabrication of pitches between pad electrodes in an IC chip, and a method of manufacturing the semiconductor device.SOLUTION: A semiconductor device comprises: a pad electrode provided on a first surface of a semiconductor substrate; and an external connection electrode corresponding to the pad electrode, which is provided on a second surface. A side surface connecting the first surface and the second surface of the semiconductor substrate is an inclined surface which is visually recognized when the first surface is viewed in a planar view. Part of inter-electrode wiring connecting the electrode and the corresponding external connection electrode is provided on the side surface.</p> |
