发明名称 |
MANUFACTURING METHOD OF PACKAGE, PACKAGE, OPTICAL DEVICE, OPTICAL SENSOR, AND ELECTRONIC APPARATUS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of assembling with high productivity even when connecting by using low-melting glass.SOLUTION: The manufacturing method of a package includes: providing a plurality of container parts 3 on a substrate 7 for a lid part so as to block an opening part 3c of each of the container parts 3 having a side plate 3b surrounding the opening 3c; connecting the container parts 3 and the substrate 7 for the lid part by using low-melting glass 4; and cutting and separating the substrate 7 for the lid part. A place where the substrate 7 for the lid part is cut and the low-melting glass 4 are separated.</p> |
申请公布号 |
JP2015088580(A) |
申请公布日期 |
2015.05.07 |
申请号 |
JP20130225057 |
申请日期 |
2013.10.30 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KOIKE SHIGEMITSU;SAITO DAISUKE |
分类号 |
H01L23/02;H01L31/12 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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