发明名称 MANUFACTURING METHOD OF PACKAGE, PACKAGE, OPTICAL DEVICE, OPTICAL SENSOR, AND ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of assembling with high productivity even when connecting by using low-melting glass.SOLUTION: The manufacturing method of a package includes: providing a plurality of container parts 3 on a substrate 7 for a lid part so as to block an opening part 3c of each of the container parts 3 having a side plate 3b surrounding the opening 3c; connecting the container parts 3 and the substrate 7 for the lid part by using low-melting glass 4; and cutting and separating the substrate 7 for the lid part. A place where the substrate 7 for the lid part is cut and the low-melting glass 4 are separated.</p>
申请公布号 JP2015088580(A) 申请公布日期 2015.05.07
申请号 JP20130225057 申请日期 2013.10.30
申请人 SEIKO EPSON CORP 发明人 KOIKE SHIGEMITSU;SAITO DAISUKE
分类号 H01L23/02;H01L31/12 主分类号 H01L23/02
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