发明名称 金型成形用離型フィルムおよびその製造方法、ならびに樹脂封止半導体の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mold release film that facilitates release of molding without use of a mold structure or release agent, and prevents the occurrence of a failure of appearance in the molding such as wrinkles or cracks. <P>SOLUTION: The mold release film is composed of: a resin composition containing a polyester resin; and 1-30 pts.mass of 4-methyl-1-pentene polymer based on 100 pts.mass of the polyester resin. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5711914(B2) 申请公布日期 2015.05.07
申请号 JP20100181741 申请日期 2010.08.16
申请人 发明人
分类号 B29C33/68;B29C45/02;H01L21/56 主分类号 B29C33/68
代理机构 代理人
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