SEMICONDUCTOR DEVICES, METHODS OF MANUFACTURING THE SAME, MEMORY CARDS INCLUDING THE SAME AND ELECTRONIC SYSTEMS INCLUDING THE SAME

摘要

Semiconductor devices are provided. The semiconductor device includes a through electrode penetrating a substrate such that an end portion of the through electrode protrudes from a surface of the substrate, a passivation layer covering the surface of the substrate and defining a plug hole that exposes the end portion of the through electrode, and a barrier plug filling the plug hole. Related methods, related memory cards and related electronic systems are also provided.

主权项

1. A semiconductor device comprising:
a through electrode penetrating a substrate such that an end portion of the through electrode protrudes from a surface of the substrate; a passivation layer covering the surface of the substrate and defining a plug hole that exposes the end portion of the through electrode, a top surface of the end portion of the through electrode corresponding to a bottom surface of the plug hole; and a barrier plug filling the plug hole.