Methods and Apparatus of Packaging Semiconductor Devices

摘要

Methods and apparatuses for wafer level packaging (WLP) of semiconductor devices are disclosed. A contact pad of a circuit may be connected to a solder bump by way of a post passivation interconnect (PPI) line and a PPI pad. The PPI pad may comprise a hollow part and an opening. The PPI pad may be formed together with the PPI line as one piece. The hollow part of the PPI pad can function to control the amount of solder flux used in the ball mounting process so that any extra amount of solder flux can escape from an opening of the solid part of the PPI pad. A solder ball can be mounted to the PPI pad directly without using any under bump metal (UBM) as a normal WLP package would need.

主权项

1. A package device, comprising:
a contact pad on a surface of a circuit; a passivation layer over the surface of the circuit and a first portion of the contact pad, wherein a second portion of the contact pad remains exposed; a post passivation interconnect (PPI) line on the passivation layer in contact with the second portion of the contact pad; and a PPI pad connected to the PPI line comprising a hollow part and an opening.