| 摘要 |
The invention describes a surge-protection arrangement (1) for an electronic device (3) comprising a heat-dissipating load (10) thermally connected to a heat sink (107) of the load (10), which surge protection arrangement (1) comprises at least one high impedance arrangement (ZHI, ZHI_N, ZHI_P) connected in series with the load (10); at least one low impedance arrangement (ZLO, ZLO_N, ZLO_P) connected in parallel with the load (10); and a ground connection (FE) arranged to electrically connect the heat sink (107) and a low impedance arrangement (ZLO, ZLO_N, ZLO_P); wherein the high-impedance arrangement (ZHI, ZHI_N, ZHI_P) is realized to discourage a common-mode surge current (Is) from entering the load (10), and the low- impedance arrangement (ZLO, ZLO_N, ZLO_P) is realized to encourage a common-mode surge current (Is) to bypass the load (10) into a ground connection (FE). The invention further describes an electronic device (3) comprising a load (10) with a number of heat-dissipating components (100) thermally connected to a heat sink (107) of the load (10); a driver (20) realized to drive the load (10); and such a surge protection arrangement (1). The invention also describes a driver (20) realized to drive an LED lighting circuit (10) and comprising such a surge protection arrangement (1); and a method of providing protection against a common-mode surge current (Is) through an electronic device (3) comprising a heat-dissipating load (10) thermally connected to a heat sink (107) of the load (10). |
