SYSTEM AND METHOD FOR CLAMPING WAFERS TOGETHER IN ALIGNMENT USING PRESSURE

摘要

A system and method for clamping wafers together in alignment using pressure. The system and method involves holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure and creating a second pressure at least partially around and between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure. The first wafer and the second wafer are clamped together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure.

主权项

1. A method, comprising:
holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure; creating a second pressure between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure; and clamping the first wafer and the second wafer held together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure.