发明名称 THIN FILM COIL, CASE ASSEMBLY, NON-CONTACT POWER RECEIVING DEVICE, AND ELECTRONIC DEVICE HAVING THE SAME
摘要 The present invention relates to a thin film coil, a case assembly, a non-contact power receiving device and an electronic device including the same. The thin film coil according to an embodiment of the present invention is a thin film coil disposed at a non-contact power transmitting device for transmitting power wirelessly or a non-contact power receiving device for wirelessly receiving the power transmitted from the non-contact power transmitting device and storing the power in a battery. The thin film coil may comprise: a substrate; a coil pattern including a first coil strip and a second coil strip arranged respectively on both surfaces of the substrate; at least one detour path having both ends connected to the first coil strip, detouring to the other surface of the substrate and partially sharing the second coil strip; contact pads arranged at both ends of the first coil strip and electrically connected to the battery; and at least one connection via arranged at the lower part of at least one among the contact pads and connecting one end of the second coil strip to the at least one contact pad.
申请公布号 KR20150048694(A) 申请公布日期 2015.05.07
申请号 KR20150054775 申请日期 2015.04.17
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LIM, DAE KI;CHANG, KI WON;HAN, CHANG MOK;NAM, HYEON GIL;LEE, HYUN SEOK;CHO, SUNG EUN;SUNG, JAE SUK;KIM, TAE SUNG;AN, CHAN GWANG;BAE, SANG WOO
分类号 H01F5/00;H01F38/14;H02J17/00 主分类号 H01F5/00
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