发明名称 THIN FILM FABRICATION APPARATUS POSSIBLE TO BOTH DIP COATING AND ELECTROCHEMICAL DEPOSITION SIMULTANEOUSLY AND METHOD FOR FABRICATING OF THIN FILM USING THE SAME
摘要 The present invention relates to a thin film forming apparatus simultaneously capable of dip coating and electrochemical deposition and a thin film forming method using the same. More specifically, the thin film forming apparatus is capable of forming a thin film while dip coating and electrochemical deposition are simultaneously applied and a thin film forming method using the same since a power source is applied with a substrate as a working electrode during a dip coating process immersing the substrate in a reaction solution and lifting the substrate.
申请公布号 KR20150048397(A) 申请公布日期 2015.05.07
申请号 KR20130128394 申请日期 2013.10.28
申请人 INJE UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION 发明人 RYU, HYUK HYUN;OH, HEE BONG
分类号 C25D7/12;B05C3/12;C25D17/00 主分类号 C25D7/12
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