发明名称 |
THIN FILM FABRICATION APPARATUS POSSIBLE TO BOTH DIP COATING AND ELECTROCHEMICAL DEPOSITION SIMULTANEOUSLY AND METHOD FOR FABRICATING OF THIN FILM USING THE SAME |
摘要 |
The present invention relates to a thin film forming apparatus simultaneously capable of dip coating and electrochemical deposition and a thin film forming method using the same. More specifically, the thin film forming apparatus is capable of forming a thin film while dip coating and electrochemical deposition are simultaneously applied and a thin film forming method using the same since a power source is applied with a substrate as a working electrode during a dip coating process immersing the substrate in a reaction solution and lifting the substrate. |
申请公布号 |
KR20150048397(A) |
申请公布日期 |
2015.05.07 |
申请号 |
KR20130128394 |
申请日期 |
2013.10.28 |
申请人 |
INJE UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
发明人 |
RYU, HYUK HYUN;OH, HEE BONG |
分类号 |
C25D7/12;B05C3/12;C25D17/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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