| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser machining method that can suppress light leakage and that can increase the width of a modified layer in a thickness direction of a workpiece, and a laser machining apparatus.SOLUTION: In a laser machining method, a workpiece is irradiated with a laser beam by positioning a condensing point of the laser beam of a wavelength with transparency within the workpiece, and a modified layer is formed within the workpiece. In the laser beam, the width of a spectral line is set at 10 pm or less. |
